You remind me of this:
That's not what I'm saying at all. The 640k deal was a choice, not due to physical limitations. Building a system that can scan incoming light at subwavelength and transfer information at 1000 to 100000 times faster than the fastest we've ever been able to achieve boils down to physics. MAYBE we can do it. MAYBE, if we produce the necessary technology by 2015 (which is when Fossum, based on that latest paper you linked, which I've already read BTW). Sorry, but I truly do not believe that even by 2017 or 2020, we will have the technology to transfer data at 100tbit/s. We won't even be close.
Your knowledge is adorable... And yet quite interesting that you DO continue to fight with the idea that he may have did it.
He hasn't done it. It's a theory. It's a concept. It isn't
an actual prototype. If it was, I GUARANTEE YOU it would make waves. It would be on every sensor-related news site and probably every technology site everywhere. Fossum wouldn't keep it under wraps. Not a chance. (You clearly don't read ImageSensorsWorld...this kind of technology, if it reaches prototype stage, will be HUGE.)
If you stop just for a second using your knowledge from here whereby this is an improvement of the CMOS:
I'm not sure what that has to do with anything. It is simply an alternative approach to making photosensitive electronics. Your readout logic is still built with standard silicon at standard sizes, transferring information at standard speeds. And the sensitivity improvement, from what I know about it, doesn't allow photon counting. There have been other improvements that increase the light gathering capacity of silicon without resorting to wet tech, such as black silicon. Even black silicon isn't going to solve the data transfer rate issue, or allow photon counting, though.
And the regular physics knowledge... Yeah I had that moment with the jots and the wavelength just as you did. But I do know that he is quite longer in this business than you and me together ;-)
DO you believe that he will reveal every detail of his study to the world so someone could steal it from him? ;-) And do you believe that he would continue for 10 years to research in that field within a reputable university and some sponsor (it could be even Samsung)?
Fossum is a researcher. He produces patents. It's what he does. So absolutely. I do believe he will reveal every detail of his research. I believe he has already revealed everything he knows. Besides, due to things like prior art, no one can really steal it from him. It's his work. He has the prior art. Even if someone tried to patent it, he could prevent it in court. He has about a decade of research and documentation to clearly prove the concept is his, and therefor not the unique invention of someone else. So yes, he absolutely would reveal all the details. He reveals details all the time, and again, if you read ImageSensorsWorld, you would know this.
Fossum doesn't HAVE the specific details for things like high speed tbit/s data transfer. NO ONE DOES. There are undoubtedly people researching it. People have been researching 500gbit and tbit data transfer rates since the 80s. I remember a Byte Magazine article from the late 80s that talked about organic memory and hundreds of gigabits per second data transfer rates. Well, were some 25 years on, and it still hasn't happened. The organic memory concept died, it just wasn't viable, and SSD offered realistic, tangible gains in performance without being unrealistically hopeful.
IF scientist were so sure like you and so negative... we would be in the medieval age, no offence.
I'm not negative. I'm realistic. You can be as hopeful as you want, but it doesn't mean your hopefulness means success. Your hopefulness is simply unrealistic given how far technology has come, and how close the walls of physics are. This isn't the 90's. Back then we couldn't even see those walls. It's now the 2010's. Two decades on, at the relentless rate we've been pushing technological advancement, those walls are right in front of us now. And not just in the case of QIS...technological advancement via traditional means (i.e. primarily via reduction in size) is going to come to a crushing halt relatively soon. Certain problems have already forced some radical changes to how we manufacture CPUs, for example, and all that's done is stave off the inevitable for a little while longer.
You also cant' forget, Fossum has been trying for a decade to design this type of sensor. A DECADE. That is a very long time to even prove a concept can work. A LOT of CIS patents files in the 80's were viable, and we knew we could eventually shrink die sizes and increase data transfer speeds to levels where we could eventually achieve them. Many of the new technologies being implemented today were actually discovered decades ago. However back then, transistor sizes were hundreds of microns in size, and data transfer rates were so low we had absolutely no question we could improve them.
Today, we've been riding the limits of Moores Law on a continuous basis. The effort involved in developing new advances costs and order of magnitude more money each time we develop a new fabrication process (i.e. it used to cost a few hundred million to build a CMOS fab, today it costs tens of billions.) Transistor sizes are approaching physical limits...the next die shrink is 14nm, and the one after that is 7nm. Gate sizes, even with 3D/finFET, are now only a couple ATOMS across. Even with stretching, that poses a real problem for current flow, hence finFET, and that is only a stopgap measure (and it imposes it's own limitations as well.) The hard, impassable physical WALL is looming very close. There are a couple generations left before there is no such thing as a die shrink anymore. We have a decade, two at most (assuming two to four years between die shrinks) before efforts begin in earnest to develop full multi-layered CPUs and the like, because that will be the only remaining option.
You call me negative. I'm just a realist. There are significant physical limitations that computer technology is already riding close to. If Fossum said he would need 100gbit/s transfer rate, I'd say "When does the technology hit?!?" Why? Because 100gbit/s is only 10x (or less) faster than the fastest transfer speeds we already have today. It's realistic, it's doable, there is already research that indicates it's possible, and it could be ready by late 2015/early 2016. Fossum said he needs 100tbit/s transfer rate, and his timetable showed 2015-2016 as his target date for QIS. Sorry, but you don't suddenly go from 10gbit/s (the fastest ethernet, and also the transfer speed of Thunderbolt) to 100tbit (100000gbit/s) overnight. It just aint gonna happen. Maybe a decade or so from now. But not by 2016. It simply isn't realistic.
There is a pdf (if in those presentations not included back dated from 2010, if I recall correctly where Fossum represents that they are to try to implement that technology (of course quite away from Q.E. of 100%) in 3 stages....
The first one on a regular CMOS. The last one on a new superconducting material... so there you go...
I believe he said the same thing in 2005. In 2010, the new superconducting material was actually just announced as something called a superinsulator. Superinsulators had been hypothesized for years, and we knew they had to exist if superconductors existed. We just didn't know how they worked. Ironically, they really don't work all that differently than superconductive material...just in the opposite (instead of encouraging cooper pairs to attract, superinsulators cause them to repel). The other sensor I've been talking about, the Titanium Nitride sensor, uses both superinsulating and superconducting properties. TiN IS the new superconducting/superinsulating material. However for those properties to exhibit, the sensor has to be cooled to absolute zero.
Again, not being negative. Being realistic. We won't have DSLR-sized cameras with supercooled sensors by 2016. Not a chance. The power and material requirements necessary to cool anything to absolute zero are immense, not to mention rather unique.
As for the CANON.. Officially 200mm is what I have head as well about CANON... but you have to admit that if you were CANON you wouldn't reveal of you are already on a 300 or 450mm wafer, now would you?
Of course they would! You really don't understand either the technologies involved here, nor the economics. Canon moving to 300mm wafers for their FF and APS-C fabrication would be a huge boon to their stock price. OF COURSE THEY WOULD OFFICIALLY ANNOUNCE IT! It's ludicrous to think otherwise, and exceptionally naive.
A proof that is this very topic here - we even are not sure what the new 1Dx m2 and 7D m2 would be look like... we are pretty confident they will include dual pix though....
Canon already has 300mm fabs for their small form factor sensors, which are built on a 180nm process rather than a 500nm process. Canon has had those fabs for years. There has been speculation that the 70D DPAF pixels would need a smaller process in order to be produced. The pixel size shrink on the 70D, however, is not actually that great. At first I thought the shrink was more significant, however the size of the 70D sensor also grew. Prior sensors were around 22.2x14.8mm in size. The 70D is 22.5x15.1mm. The increase in size means instead of a 3.9µm pixel, they actually have 4.1µm pixels. The pixels are only 0.2µm smaller than the 7D. There isn't any need for Canon to reduce their process size to split those pixel in two...they are still more than large enough. Even at 3.9µm, they would still be large enough.
As much as I personally hoped Canon would move the 70D to a smaller process, there just isn't any evidence to support that theory. Physically, Canon still has space to use a 500nm process, even with dual photodiodes. When you think about it, doping the photodiodes really is not that big of a deal, as the photodiodes themselves are a couple thousand nanometers in size, which is about four times larger than the smallest 500nm etching possible with a 500nm process.
If Canon had moved FF and APS-C manufacturing to a 300mm wafer fab, they would have announced it. It would be a massive move, and a move for the better, for Canon as a company, for their shareholders, for their customers. A move to 300mm means more FF sensors manufactured faster with less waste, reducing cost, allowing more electronics on-die at a smaller transistor size, etc. It would be big news, for everyone. No way in hell would Canon hide that fact.
Which reminds me that we even didn't know about the DUAL PIX just before the release of 70D - a few months before that we had some rumor about new focus tech... And you, as well as the others are quite aware that Dual PIX AF didn't emerge like that in the last 6 months before the 70D, now did it? ;-)
The technology had to be in development for more than 6 months before the 70D hit the streets. Canon has patents on the technology. If someone was digging, they would have found them (quite possibly LONG before the 70D hit the streets, as patents have to be requested and then filed quite some time before they are granted. You don't know about the request, but once they are filed, it's all public knowledge...you can find it if you want to. I used to go digging through CIS patents...I don't have enough time to do that any more, but I don't doubt that the patents were out there before the 70D hit the streets.)