The next major innovation from Sony is to combine the image processing logic with the sensor die using a "3D" layered die attachment process. That won't really revolutionize IQ ...
Maybe not revolutionize but will constitute the next major step in performance.
The big thing about the stacked/3D design is that the circuitry layer can be made ... cheaply ... on a state-of-the-art chipmaking process (say 45nm).
This will allow the integration of sophisticated on-sensor signal processing (per-pixel ADCs, dual conversion gain, etc.) - and in turn better overall sensor performance, which might prove impossible to match by a 'standard' sensor.
So, the stacked/3D design has a lot of promise, actually.
And unlike current BSI techologies, it will be much more cost-effective to scale to DSLR sensors.