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Topics - swrightgfx

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Hello all,

I wasn't sure where to put this, as it could apply to both EOS and consumer or mirrorless devices.

Anyway, attached is a patent application for what seems to be a new method for phase detection autofocus, not requiring an AF sensor within target of a half mirror, quick return mirror, etc. From my understanding, the want to do away with a dedicated AF sensor for phase detection and instead incorporating it into the sensor would be either to save space and reduce the size of future entry-level SLRs, or as a method for a future mirrorless to knock over the competition. (As far as I know, the Nikon 1 is the only mirrorless to feature a form of phase detection at a sensor level, albeit "hybrid" with contrast detection.)

Thoughts?

EDIT: Notice the focus on video and the allowance for switching between pixel skipping and binning.

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EOS Bodies / Four-Thirds/APS-C CCD Sensor Patent
« on: April 17, 2012, 01:48:33 AM »
Good afternoon,

http://www.wipo.int/patentscope/search/en/detail.jsf?docId=WO2012026074&tab=FullText

I came across this patent for what appears to be plans for a (most likely CCD) Four-Thirds or APS-C sensor "and camera." (The bottom flowchart almost gives the illusion of a large-sensor camcorder, but I am sure the orientation of the layout is not necessarily indicative of the device layout.)

Note the sensor "thickness" chart goes all the way to full-frame but the proceeding claims relate only to Four-Thirds, APS-C and 1/2.5" (the latter a call back to point-and-shoots like the IXUS 800/850 IS).

Quote
Claim 6
The image pickup device according to any one of Claims 3 to 5, wherein the image pickup element chip has a size corresponding to the size of a Four Thirds chip, and each of the thickness T1 of the silicon substrate in the first area and the thickness T2 of the silicon substrate in the second area is equal to or greater than 0.4 mm.
Claim 7
The image pickup device according to any one of Claims 3 to 5, wherein the image pickup element chip has a size corresponding to the size of an APS-C chip, and each of the thickness T1 of the silicon substrate in the first area and the thickness T2 of the silicon substrate in the second area is equal to or greater than 0.6 mm.
Claim 8
The image pickup device according to any one of Claims 3 to 7, wherein in the orthogonal projection that is orthogonal with respect to the transparent member, the relationship between the thickness T2 and the width W2 of the silicon substrate in the second area satisfies expressions (2) and (3):
Claim 9
The image pickup device according to any one of Claims 3 to 5, wherein the image pickup element chip has a size corresponding to the size of a Four Thirds chip, the thickness T2 of the silicon substrate in the second area is equal to or greater than 0.4 mm, and the width W2 of the silicon substrate in the second area is equal to or greater than 1.0 mm.
Claim 10
The image pickup device according to any one of Claims 3 to 5, wherein the image pickup element chip has a size corresponding to the size of an APS-C chip, the thickness T2 of the silicon substrate in the second area is equal to or greater than 0.6 mm, and the width W2 of the silicon substrate in the second area is equal to or greater than 1.4 mm.
Claim 11
The image pickup device according to any one of Claims 3 to 5, wherein the image pickup element chip has a size corresponding to the size of a 1/2.5-inch chip, the thickness T2 of the silicon substrate in the second area is equal to or greater than 0.1 mm, and the width W2 of the silicon substrate in the second area is equal to or greater than 0.4 mm.

While the patent relates to a "solution to a problem," it seems to me to be a completely new design - a solution to a problem you would expect to include additions and not a complete redesign.

Scott

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