Stacked sensor related patents continue to roll out from Canon. Canon News has uncovered the latest in a long list of stacked sensor patents.
Canon News breaks down the patent:
In another patent application describing stacked BSI sensors, canon looks to solve problems with high melting point metal is moved from being on the sensor substrate to only on the peripheral circuit substrate. They are concerned that the high melting point metal will diffuse into the photo diodes collecting image data. Read the full breakdown
It’s worth noting that this sort of technology is especially important for mirrorless camera applications as it improves performance as well an improved ability to collect light at “high incident angles” says Canon News.