As I looked at this design in detail, I thought only "Harry-whatever" could have come up with something like this! Then I wondered who did post it, and shazam! - there he was! You never know whether his posts are real and brilliant, or so ridiculous that you feel embarrassed over taking them seriously. I prefer to take them as entertainment - well done, Harry!
I put it out there for giggles mostly until my actual degree-carrying colleague reviewed it and made it known to me after noting another poster who said LI-900 would be an insulator of the copper heat transfer plates and pipes and would stay hot. It seems if you use FIBROUS silica (or any other fibrous material), very little heat transfer would take place as it becomes an insulator.
The heat transfer would NOT be fast enough to cool the CPUs!
My older shown design would ONLY WORK at much higher temperatures quite exceeding hundreds of degrees kinda frying the camera cpus. That design ONLY WORKS for things like insulating a spacecraft during re-entry where huge heat differentials are required for the LI-900 tile to act heat-sink-like. (i.e in excess of 500 Celcius)
Anyways, a revised version of the design is noted below with the changes designed for consumer devices using more contemporary heat sink materials such as actual Carbon-Carbon Composite, Solid BoroSilicate Glass or even Fire Brick!
OOOOPS! That was my earlier mistake! Again, the design MUST be thermally profiled, modeled and simulated on a computer first BEFORE anyone tries to use it! The design only looks ridiculous because I'm just layman making things work out in my workshop. Once in a while I get it right! MODEL IT AND TEST IT BEFORE YA USE IT IS MY WARNING!
Soooooo --- ONTO THE NEXT ALMOST RIDICULOUS DESIGN OF MINE!
Transcode to prores or dnx. Not that hard, just takes a little extra time. When i rented an xf705 i had to do the same thing. People love to complain, sheesh. Can't wait till h266 becomes mainstream and everyone will loose their minds all over again.